New SMT Equipment: hot air ir preheat (Page 1 of 7)

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Middle Size Lead Free SMT Reflow Oven for LED A600

Middle Size Lead Free SMT Reflow Oven for LED A600

New Equipment | Reflow

Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Peak - Lead-Free Wave Soldering System Series

Peak - Lead-Free Wave Soldering System Series

New Equipment | Wave Soldering

Peak series soldering machine shows superiority in performance, stability, reliability, safety, operability and maintainability. Aims to reduce customer operational cost (especially reduced the solder dross and oxidation significantly) and improves s

SUN EAST Tech Development Co., Ltd.

BGA rework BGA welding BGA welding equipment

BGA rework BGA welding BGA welding equipment

New Equipment | Rework & Repair Equipment

BGA rework BGA welding BGA welding equipment Power source: AC220V±10% 50/60Hz Work rate: 4500 W Heating power: Temperature range of the upper temperature range of 800 W lower temperature range of the IR 2400 W, 12

Goodluck Electronic Equipment Co., Ltd

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station

Scotle Technology Group Limited

SelHeat400 Inline Preheating Module

SelHeat400 Inline Preheating Module

New Equipment | Wave Soldering

SelHeat400 is a single rail inline preheating machine with an individual controlling system. It is equipped with IR heating for both upper and bottom sides, with touchscreen and PLC as a controlling system. The conveyor is equipped with a Smema conne

Advanced Soldering Technology Co., Ltd

Hakko FR-872 IR Preheater

Hakko FR-872 IR Preheater

New Equipment | Rework & Repair Equipment

4-BANK IR PCBOARD PREHEATER. The FR-872 is a low profile, bench-top PCBoard preheater designed to elevate the temperature of printed circuit board assemblies so that components on them can be soldered and de-soldered more easily, and with improved

American Hakko Products, Inc.

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