New SMT Equipment: hot bar bonder (Page 1 of 4)

ACF Bonding

New Equipment | IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations

Microjoin

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.

Hot Bar Soldering

New Equipment |  

Reflow Systems, Power Supplies, Reflow Heads, Custom Fixtures

Microjoin

Electrode Tips and Bars

New Equipment |  

Ceramic Hot Bars, Metal Heater Bars, Custom Fixtures, Weld Tips,

Microjoin

Hot Bar Soldering Machines

New Equipment | Other

We offer a number of soldering machines for bonding Flex to PCB, Connector to PCB and micro cables to PCB/ connectors.

Production Technologies Ltd

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

New Equipment | IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon

Finetech

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

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hot bar bonder searches for Companies, Equipment, Machines, Suppliers & Information

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World's Best Reflow Oven Customizable for Unique Applications
PCB separator

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