New Equipment | Industrial Automation
In partnership with Universal Instruments, Hover-Davis will demonstrate its new Radial, Tube and Tray feeders for SMD and odd-form electronic components such as relays, connectors, capacitors, LEDs and more. Originally developed and proven on Univers
Hover-Davis Direct-Die Feeders for wafer-packaged semiconductor and MEMS devices extract and present .7mm up to 11mm die from 100, 150, 200, and 300mm wafers. DDF2 facilitates flexible single-wafer loading while the new DDF3 includes cassette loading
| 1 |
