New SMT Equipment: humiseal uv 40 curing (Page 1 of 2)

UV-light source for spot curing within seconds UVLQ-400

UV-light source for spot curing within seconds UVLQ-400

New Equipment |  

Flexible light guides permit strongly localised irradiation. Quick curing of selective sticking and controlling of polymerisation processes is possible using such UV-plants. Different versions of our UV-light-source for high intensive UV irradiation

Dr. Gr�bel UV-Elektronik GmbH

HumiSeal® PCB Conformal Coatings

HumiSeal® PCB Conformal Coatings

New Equipment | Coating Materials

HumiSeal produces conformal coatings from all chemistries, including acrylics, urethanes and silicones, both water based and UV curable. This represents the widest product range and the largest choice of qualified products currently available. We ar

Chase Electronic Coatings

SCS Curing Systems

SCS Curing Systems

New Equipment | Curing Equipment

When materials require UV curing, manufacturers turn to the SCS Precision UVC as a reliable, robust staple in their production line. When mated with the SCS Precisioncoat, components move from coating to curing automatically, with the UV cure process

Specialty Coating Systems

Henkel Conformal Coatings

Henkel Conformal Coatings

New Equipment | Coating Materials

70% humidity 120 -40°C to 105°C Urethanes HYSOL PC18M Flexible one-component solvent-based urethane coating which may be cured at room temperature. Meets MIL-I- 46058C. 2 h

Henkel Electronic Materials

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Passive SMD Magnetic Buzzer ab epoxy potting machine

Passive SMD Magnetic Buzzer ab epoxy potting machine

New Equipment | Dispensing

Passive SMD Magnetic Buzzer ab epoxy potting machine Product Description 2 component polyurethane injection resin machine dispensing machine for pu compound Where to buy PU , epoxy bonding machine ? We Daheng Automation specialize in different ty

Guangzhou Daheng Automation Equipment Co.,LTD

EP-600 Two-part Silver Conductive Epoxy

EP-600 Two-part Silver Conductive Epoxy

New Equipment | Materials

4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

China  Meter Mix Dispensing Machine for Silicone, Epoxy Resin, Polyurethane Resin

China Meter Mix Dispensing Machine for Silicone, Epoxy Resin, Polyurethane Resin

New Equipment | Dispensing

China Meter Mix Dispensing Machine for Silicone, Epoxy Resin, Polyurethane Resin Product Description 2K Dosing Manual Filling Machine Fluid Dispenser for 2 Part Potting Compound Multi-Axis Glue Dispenser Robot We Daheng Automation specialize in dif

Guangzhou Daheng Automation Equipment Co.,LTD

PGB 700 CNC 3 axis 2K AB glue potting silicone epoxy pu glue dispensing dispenser automatic machine

PGB 700 CNC 3 axis 2K AB glue potting silicone epoxy pu glue dispensing dispenser automatic machine

New Equipment | Dispensing

Full automatic model with 3 axis bi-component potting compound dosing and dispensing machine PGB-700 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syri

Guangzhou Daheng Automation Equipment Co.,LTD

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