Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
New Equipment | Coating Materials
70% humidity 120 -40°C to 105°C Urethanes HYSOL PC18M Flexible one-component solvent-based urethane coating which may be cured at room temperature. Meets MIL-I- 46058C. 2 h
New Equipment | Coating Materials
We use the following types of conformal coating at Arizona ProCoat LLC. Acrylic (Type AR) Polyurethane (Type UR) Silicone (Type SR) Standards used by the industry are IPC-CC-830, Mil-I-46058C, Mil-P-28809 and UL746C. We are proud to use Humis
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
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