New SMT Equipment: ic packages (Page 5 of 4113)

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

ultra thin FR4 pcb boards manufacture for IC/wafer package/Sip package,IC substrate board

New Equipment | Fabrication Services

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 milli

Horexs (Hubei)Electronic Limited/HongRuiXing

Quik-Pak, a division of GEL-PAK

New Equipment |  

Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing

Quik-Pak

MicroSD card circuit boards/IC package/assembly SIP package thin FR4 PCB manufacturer

MicroSD card circuit boards/IC package/assembly SIP package thin FR4 PCB manufacturer

New Equipment | Fabrication Services

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 milli

Horexs (Hubei)Electronic Limited/HongRuiXing

Thermal Shock Test Chamber

Thermal Shock Test Chamber

New Equipment | Test Equipment

Thermal Shock Chambers test products performance to withstand continuous high low temperature cycles, the purpose is to analyze and evaluate products safety performance and screen unqualified ones, it can finalize products chemical changes/physical d

Symor Instrument Equipment Co.,Ltd

Amkor IC Pacakge Portfolio

New Equipment |  

Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet

Amkor Technology, Inc.

Formosa Water Soluble Solder Paste

Formosa Water Soluble Solder Paste

New Equipment | Solder Materials

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,

Shenmao Technology Inc.

Quik-Pak, a division of GEL-PAK

Quik-Pak, a division of GEL-PAK

New Equipment |  

Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing

Quik-Pak

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Optoelectronics

New Equipment |  

Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin

Promex Industries, Inc.


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