New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
MIRTEC: Automated Optical Inspection Systems Tabletop and In-Line AOI Systems 15 Megapixel 2D/3D MV9 AOI Series Five Camera Technology 2D/3D Inspection Capability / 3D OMNI-VISION / 6 Phase Color Lighting System Intelli-Scan For Lift
The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connector
The VT-S730 is a High Quality Inspection system, meeting the needs of all SMT Processes. 3D-SJI: Unique COMBO patented technology RGB/Phase Shift IPC standard compliance in full real 3D Telecentric Camera Lens Multi-Angled, Oblique Cameras Use
Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
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