New SMT Equipment: immersion depth (Page 1 of 1)

Wave Solder Optimizer - Wave Shuttle PRO

Wave Solder Optimizer - Wave Shuttle PRO

New Equipment | Wave Soldering

The SolderStar WaveShuttle PRO is a wave optimizer that quickly allows you to analyse, improve and gain control of your wave soldering process. This unique fixture incorporates two measurement systems to give the most comprehensive and repeatable mea

Solderstar

WaveRIDER® NL 2 Wave Soldering Machine Optimizer

WaveRIDER® NL 2 Wave Soldering Machine Optimizer

New Equipment | Wave Soldering

The only portable wave soldering machine optimizers with statistical process control (SPC) The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER® NL 2 greatly simplifies wave solder set up and ensures perf

Electronic Controls Design Inc. (ECD)

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban

Advanced Circuitry International

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PCB Handling Machine with CE

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Reflow Soldering 101 Training Course