8-layer PCB with impedance control. Surface Finish: Immersion Gold
Bicheng provides impedance controlled PCB's for R&D, high-tech, IT research companies and organizations, large or small. Technical parameters *Controlled dielectric *Controlled impedance *Design coupons *Test coupons *Po
Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled
Layer: 12 Material: FR4(Tg170) Board thickness: 1.6mm Min trace width/spacing: 4/4mil Min hole size: 0.2mm Impedance control
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
1. FR-4 Tg170 2. 20 layer, 1.6mm thick 3. 1 oz copper finished 4. 10% impedance control 5. Blind/buried vias 6. 0.1mm holes, HDI 7. Application: telecommunication, industrial control, medical equipment
Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen
FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control
Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
