Layer: 12 Material: FR4(Tg170) Board thickness: 1.6mm Min trace width/spacing: 4/4mil Min hole size: 0.2mm Impedance control
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen
FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control
1. FR-4 Tg170 2. 20 layer, 1.6mm thick 3. 1 oz copper finished 4. 10% impedance control 5. Blind/buried vias 6. 0.1mm holes, HDI 7. Application: telecommunication, industrial control, medical equipment
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
New Equipment | Test Equipment
This product is NEW USD $6960.00 Megger BITE 2 Megger Model # BITE 2 Catalog # 246002B Battery Impedance Test Equipment Determines condition of lead-acid and NiCd cells up to 7000 Ah On-board Pass/Warning/Fail indications Robust,
New Equipment | Test Equipment
Hioki IM3570 Impedance Analyzers $9995.00 IMPEDANCE ANALYZER IM3570 Single-device solution for high-speed measurement, even when switching between different measurement conditions The need to take readings of multiple parameters under d
1109 20GHz TDR Tester Product Classification: TDR Method Impedance Tester for High Speed, High Frequency Boards Product Description: The 1109 20GHz TDR Tester provides a test head equipped with dedicated high-frequency probes for TDR measurement w
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