New SMT Equipment: in paste placement (Page 1 of 8)

Smt I-pulse K01 nozzle used in pick and place machine

Smt I-pulse K01 nozzle used in pick and place machine

New Equipment | Pick & Place

Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00

ZK Electronic Technology Co., Limited

SMT JUKI Nozzle KE2000/2010/2020/2030/2040 503 504 502 507 used in pick and place machine

SMT JUKI Nozzle KE2000/2010/2020/2030/2040 503 504 502 507 used in pick and place machine

New Equipment | Pick & Place

SMT JUKI Nozzle KE2000/2010/2020/2030/2040 503 504 502 507 used in pick and place machine JUKI Smt nozzles models: Juki KE700 Nozzle E3501-721-0A0 JUKI NOZZLE 101 ASSY E3502-721-0A0 JUKI NOZZLE 102 ASSY E3503-721-0A0 JUKI NOZZLE 103 ASSY E3504-721-0

ZK Electronic Technology Co., Limited

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

HotDots™ for Holding Jumper Wires in Place

HotDots™ for Holding Jumper Wires in Place

New Equipment | Rework & Repair Equipment

BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a

BEST Inc.

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Full Automatic visual placement machine KT6280 for Electronic Components

Full Automatic visual placement machine KT6280 for Electronic Components

New Equipment | Pick & Place

Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China  Email: salemachines@bjclkdkj.cn  Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496  

Beijing Chengliankaida Technology Co.,Ltd

Spray in Air Systems

New Equipment |  

Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards

Petroferm Inc

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