CL-1500 high precision automatic solder paste screen printer designed for high precision screen printing or stencil printing for PCBS of LED Lighting products. Support PCB size from 100mm x 50mm to 1500mm x 350mm and PCB thickness from 0.8mm to
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
BotFactory Squink is a Desktop Electronics Printer, capable of creating PCBs in less than an hour for the fraction of the cost - only $2999 for the base unit! There are three toolheads, a heatbed and an onboard computer to handle trace printing, sold
High-speed High-precision Universal High-end SMT Screen Printer With the speed of the Yamaha mounters you need reliable, high speed solder paste printing. Built on the same YSP monocoque frame as Yamaha’s mounters the Yamaha YSP printer provides th
70 percent of SMT manufacturing defects are caused during the solder paste printing process. Detection of these printing defects can greatly increase the overall quality of finished products and decrease the human hours associated with post-process r
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
