Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor Lith
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor L
New Equipment | Industrial Automation
Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m
New Equipment | Industrial Automation
Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m
New Equipment | Industrial Automation
ABB CI615K01 3BSE000756R1 Description: Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! -
New Equipment | Industrial Automation
ABB CI615K01 3BSE000756R1 Description: Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! -
New Equipment | Industrial Automation
ABB CI615K01 3BSE000756R1 Description: Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! -
Automatic Identification for Wafer Traceability The intensely competitive global semiconductor industry demands ever more rigorous control of increasingly complex processes in order to maximize tool utilization and production yield; there is zero m
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
