New SMT Equipment: inlines (Page 1 of 138)

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Vertical Curing Mini Oven - Heller 755

Vertical Curing Mini Oven - Heller 755

New Equipment | Curing Equipment

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod

Heller Industries Inc.

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Selective Conformal Coating Systems - Tilt and Rotate

Selective Conformal Coating Systems - Tilt and Rotate

New Equipment | Coating Equipment

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Panasonic NPM Modular SMT Chip Mounter Machine

Panasonic NPM Modular SMT Chip Mounter Machine

New Equipment | Pick & Place

Panasonic NPM Modular SMT Chip Mounter Machine Product name Panasonic NPM  SMT Chip Mounter Model NPM-D3 NPM-W2 NPM-TT2 NPM-W2S Concept Dual-gantry, multi-head,  process-driven module Dual-gantry,

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

PCB Separator Inline Printed Circuit Board PCB Depaneling Equipment with V-cut

PCB Separator Inline Printed Circuit Board PCB Depaneling Equipment with V-cut

New Equipment | Depaneling

40° Cutting speed 300-500/s Blade material High speed steel Air pressure 0.5-0.8Mpa Voltage 220/110V Dimension 1250(1560)mm×800mm×1295mm Packaging weight 300kgs PCB Sepa

ChuangWei Electronic Equipment Manufactory Ltd.

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