New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Test Equipment
The TDS3014 Digital Phosphor Oscilloscope (DPO) features advanced waveform capture, display, and measurement capabilities. The instrument delivers three dimensions of signal information (amplitude, time, and distribution of amplitude over time) in re
New Equipment | Wave Soldering
Cost effective, medium to high volume, automatic titanium finger 14" single and dual wave soldering systems. Medium to High Volume Production Wave solder machine with complete automation of self-contained fluxing, preheating, laminar (smooth) and
JJS’s box build assembly capability is a key element of our total turnkey contract manufacturing solutions. Complementing our printed circuit board level assembly, JJS Electronics’ provides a broad range of mechanical assembly, high level box build
Expedition Enterprise™ Provides highly integrated, comprehensive PCB design-to-manufacturing tools that promote collaboration across the extended enterprise. Expedition Enterprise™ from Mentor Graphics is the industry’s most innovative PCB design f
Z-Communications PLL modules are designed for use in any variety of today�s commercial wireless applications. Current solutions are available from 100 MHz to 5.5 GHz and can be programmed to lock at specific frequencies through a 3-wire CMOS serial i
Wireless communication provides speed and convenience for automobile technicians. ConnexRF transceivers embedded in wheel-heads take information from the alignment sensors and communicate that data to the server radio located in the console. The serv
Core Capabilities � PCB Fabrication � PCB Assemblies � Box Builds � Assembly from kitted inventory � Parts procurement and guaranteed assembly � Turnkey manufacturing � Conformal coating � Wire & Mechanical Assembly Value Added Capabilities �
The DataPlace� Model 100LP automated print & apply labeling system is leading the way as the industry's best solution for automated labeling of electronic assembly products. It sets new standards with FAST placement rates (3600 pph), a dual-nozzle he
Specialist's in the integration, design and specification of Open Automation and Internet Enabled Solutions in all types of industry. Engineers would like to future-proof installations, open solutions offer this and much more, including savings and b
