New Equipment | Test Equipment
Localized Electronics Cleanliness Tester and Residue Extractor The information gathered when using the C3 is intended to provide a measure of the cleanliness of a localized region of a circuit board. In addition, the C3 extracts a sample of the effl
Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
New Equipment | Cleaning Agents
IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Test Equipment
Test of Assemblies available from go no go to comprehensive testing fitting requirements
New Equipment | Assembly Services
Sierra Assembly’s Box Build Assembly Services We provide the following types of box build assembly services: Product Assembly Sub-level Product Assembly System Level Assembly Complete Product Testing including Functional, Environmental, and Bur
New Equipment | Cleaning Equipment
High Temperature, High Pressure Aqueous/Semi-Aqueous Batch Electronics Cleaning Systems Forget the limitations of the past and experience a batch system that offers multiple cleaning technologies for capability previously unachieved in a compact fo
Thermal infrared (IR) imaging analysis aids dramatically in characterizing an electronics assembly’s thermal dissipation and identifying peak junction temperatures of the populated component set. The results from IR Thermography testing can influence
New Equipment | Design Services
Assembly and test engineering integration automation. Default two type design solution widely used In series - Traditional and stable In parallel - Advanced extension multiple combinations http://tipcogp.com/en/en/assembly-and-t
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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