New SMT Equipment: ipa cleaning (Page 1 of 1)

CitraFlor EG3

New Equipment | Cleaning Agents

Use CitraFlor EG3 to replace IPA in cleaning applications. Citrus based cleaner. Multi-purpose product used for stencil cleaning, misprint cleaning, and cleaning flux after rework.  

Florachem Corp

ProClean�

ProClean�

New Equipment |  

Aerosol Aerosol w/ Brush Presaturated Wipe Presaturated Wipe Refill 1 gallon Pail 5 gallon Pail 55 gallon Drum Mil-Spec Quality Defluxing from This Unique Blend of Three Alcohols Out-Cleans Ordinary IPA Absolutely Plastic-Safe Extremely Affo

MicroCare Corporation

CYBERSOLV® C8622 - Safe / Effective IPA Alternative Solvent

CYBERSOLV® C8622 - Safe / Effective IPA Alternative Solvent

New Equipment | Cleaning Agents

CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna

KYZEN Corporation

SynTECH™ No-Clean Solder Paste

SynTECH™ No-Clean Solder Paste

New Equipment | Solder Materials

8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce

AMTECH

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

New Equipment | Cleaning Agents

CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS

KYZEN Corporation

NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

New Equipment | Solder Materials

High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing

AMTECH

Nano-ProTek - Stencil Coating

Nano-ProTek - Stencil Coating

New Equipment | Solder Paste Stencils

DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num

ASM Assembly Systems (DEK)

KYZEN® E5615 - Fast Drying Stencil Cleaner

KYZEN® E5615 - Fast Drying Stencil Cleaner

New Equipment | Cleaning Agents

KYZEN® E5615 is an aqueous based cleaner designed to be the fastest drying chemistry in the industry. E5615 is shipped ready to use and successfully removes unreflowed solder paste from stencils and related equipment. Fast Drying No Rinse Require

KYZEN Corporation

X-Series PCB Stencil Cleaners

X-Series PCB Stencil Cleaners

New Equipment | Cleaning Equipment

PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and

Austin American Technology

MULTICORE Solder Fluxes

MULTICORE Solder Fluxes

New Equipment | Solder Materials

With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f

Henkel Electronic Materials

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