Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s
mBGA, BGA and QFP Placement and Rework: 1. Beam Splitter for superimposing component and board images 2. 7X to 40X magnification 3. Optional image splitter for four side viewing at high magnification 4. Placement and reflow in one position
SIPLACE D3 � Multi Functional Placement Machine The SIPLACE D3 with its three gantries can place up to 30,100 components per hour and can be equipped with a SIPLACE TwinHead. That makes the SIPLACE D3 a fast and flexible all-rounder that can even pl
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Mechatronic systems�s P20/P40 are flexible solutions for small and medium value series in the SMT-production. These machines were developed for assignments with claim for quick change of products, operating simplicity and reliability. Thanks to the
1, All the main parts of the equipment are imported parts, long service life. 2, using the upper and lower two temperature control area, using PID automatic fuzzy temperature control system, high precision temperature control, high stability, tempera
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
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