JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
Hanwha SM485P Pick and Place Machine Placement speed: 12,000 CPH (Optimum) Machine dimension: 1650*1679*1993mm Weight: Approx 1600kg SM485P is a multifunctional Hybrid Pick and Place Machine. In addition to SMD components, it can quickly and reliabl
Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s
mBGA, BGA and QFP Placement and Rework: 1. Beam Splitter for superimposing component and board images 2. 7X to 40X magnification 3. Optional image splitter for four side viewing at high magnification 4. Placement and reflow in one position
SIPLACE D3 � Multi Functional Placement Machine The SIPLACE D3 with its three gantries can place up to 30,100 components per hour and can be equipped with a SIPLACE TwinHead. That makes the SIPLACE D3 a fast and flexible all-rounder that can even pl
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Mechatronic systems�s P20/P40 are flexible solutions for small and medium value series in the SMT-production. These machines were developed for assignments with claim for quick change of products, operating simplicity and reliability. Thanks to the
1, All the main parts of the equipment are imported parts, long service life. 2, using the upper and lower two temperature control area, using PID automatic fuzzy temperature control system, high precision temperature control, high stability, tempera
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
