New SMT Equipment: ipc tm 650 2.3.28 (Page 1 of 5)

AutoCAF2

AutoCAF2

New Equipment | Test Equipment

AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper

Gen3 Systems

Electrical Test Services

Electrical Test Services

New Equipment | Test Services

STI offers a variety of electrical test services from component-level testing/characterization to system-level testing.  Electrical testing is offered to validate values in accordance with component manufacturer's performance specifications, a custom

STI Electronics

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

Ionograph® SMD V - Ionic Contamination Test System

Ionograph® SMD V - Ionic Contamination Test System

New Equipment | Test Equipment

Fast and accurate ionic contamination cleanliness testing. Dynamic testing of ionic contamination is a widely approved and followed standard. So, too, is the equipment that makes it possible - SCS Ionograph®. Available in different models, the SCS

Specialty Coating Systems

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560

New Equipment | Other

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,

Flasonsmt Co.,ltd

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560

New Equipment | Other

Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,

qismt electronic co.,ltd

NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

New Equipment | Solder Materials

High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing

AMTECH

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

PRO1600-RS Reflow Simulator

PRO1600-RS Reflow Simulator

New Equipment | Reflow

PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi

Advanced Techniques US Inc. (ATCO)

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

New Equipment | Materials

Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature

Isola Group


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