New Equipment | Education/Training
Component Rework/Board Repair Training This is a 5-day, advanced course for anyone responsible for quality and reliability of reworked or repaired electronic assemblies. It is a comprehensive hands-on training program with 80% lab work. The certific
The most flexible pick and place system, the LS60, offers technologically advanced features with a 13" x 32" (330mm x 813mm) work area, 144 feeder positions where quick setup, ease of operation and high reliablity are paramount. The highest
Flexible, Scalable Solutions For Maximum Versatility. Advantis® sets a higher standard for midrange assembly solutions, offering unmatched performance and flexibility at a low entry price. Advantis delivers scalable capacity, easy-to-use operation,
The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime
Most flexible pick and place model with Vision offers technologically advanced features and automation with a 13" x 32" (330mm x 813mm) work area, 132 feeder positions where quick setup, ease of operation, and high reliablity are paramount. NEW LS60
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi
New Equipment | Education/Training
Designing Flex and Rigid-Flex Applications Duration: 90 minutes Abstract: Of course they bend and can be formed, but did you know that flexible circuit boards are lighter weight, more durable and more cost effective than a rigid board or wiring
Premium model with unmatched precision for low to medium production runs utilizing Cognex® Vision system. The LS40V is our most popular model with Vision. The LS40V offers technologically advanced features with a 13" x 22" (330mm x 559mm) work area
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
New Equipment | Education/Training
Get Ahead... Smart decisions and top-notch quality are critical to success — particularly in the highly competitive, ever-changing electronic interconnection industry. Training alone may help with your quality initiatives, but when key employees act
