LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
New Equipment | Fabrication Services
Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies. We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
Stand alone Semi-Automatic Stencil Printers with optional Accu-Lign Series Vision Alignment featuring " Train on Paste " capability to make set up a snap. Also available Programmable Squeegees and Under Stencil Wiper Module. 4 Available Vision L
World's Largest Print Area Stencil Printers for Ultra Fine pitch solder paste printing Models with 24" x 24", 30" x 32", 30" x 38", 30" x 46", and 30" x 60" Print Areas Windows NT-Based Operating System Accu-Lign Series 3 Automatic Visio
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
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New Equipment | Industrial Automation
GE Bently Nevada 3300/16 3300/16-15-01-03-00-00-00 Dual Thrust Position Monitor Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warran
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