New Equipment | Assembly Services
Turnkey PCB assembly & manufacturing is the optimal solution for engineers with urgent, high complexity projects who want to avoid project management headaches. Providing turnkey PCB assembly services means that the provider will handle all the task
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
Printed Circuit Board Assembly Services Through-Hole Our wave soldering and hand soldering processes are fully compliant with the highest commercial (IPC-A-610D) and military specifications. Surface Mount We use automated screen printing and pick-
New Equipment | Cleaning Agents
AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® A4708 is specifically form
New Equipment | Cleaning Agents
220°F/104°C Boiling Point 240°F/115°C Water Soluble Complete VOC, @10% 88.9 g/L Typical Processes: Application In-Line
New Equipment | Cleaning Agents
220°F~104°C Boiling Point 280°F~138°C Water Soluble Complete VOC, @10% 90.0 g/L Typical Processes: Application Spray
New Equipment | Cleaning Agents
200°F~93°C Boiling Point: 292°F~144°C Water Soluble: Partially miscible VOC, @ 10%: 88.45 g/L Typical Processes Application: Spray-in-Air / Select Ultrasonic Stencil Cleaners Concentration: 25% Temperature: Ambient to Rinse: Optional Dry
New Equipment | Cleaning Agents
Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX® A4638 is designed to remove water s
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
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