New SMT Equipment: ipc-a-610 hole fill (Page 1 of 5)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

IPC-A-610D - Acceptability of Electronic Assemblies - 1 Day Classes

New Equipment | Education/Training

This latest version D of the IPC-A-610 released in  Released February 2005,  Presented in a one day class this is a must for all quality assurance and assembly departments.  IPC-A-610D illustrates industry-accepted workmanship criteria for electronic

Precision PCB Services, Inc

IPC J-STD-001F Standard

IPC J-STD-001F Standard

New Equipment | Education/Training

IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies.  The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001

BEST Inc.

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

DRM-PTH-F Through-Hole SolderJoint Evaluation Training & Reference Guide

New Equipment | Education/Training

Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch

soldertools.net

J-STD-001 Rev G Standard

J-STD-001 Rev G Standard

New Equipment | Soldering - Other

IPC J-STD 001 REV G Requirements for Soldered Electrical and Electronic Assemblies.  The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released October 2017. IPC J-ST

soldertools.net

Process Capabilities (Lead & RoHS

Process Capabilities (Lead & RoHS

New Equipment |  

Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu

Silicon Forest Electronics

PCB Assembly

PCB Assembly

New Equipment | Assembly Services

- Full ESD safe factory with regular mandatory ESD level checks. - Humidity controlled storage for components & PCB's. - SMT pick & place from 0402 to QFP/BGA. - 8 zone convection reflow for SMT components - PCBs up to 300mm width. - Wave solderi

Team Manufacturing Services (TMS)

PCB & SMT Assembly

PCB & SMT Assembly

New Equipment |  

AccuSpec Electronic Services utilizes both automated and manual equipment to assemble low to high volume thru-hole PCB assemblies. The production areas are within an ESD and climate controlled environment. Personnel are trained and qualified in IPC-

AccuSpec Electronics, LLC

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