New Equipment | Rework & Repair Services
BEST's QFN Rework Services Can Save Your Design and Save You Money BEST Inc. provides a variety of QFN rework services including the most popular QFN package styles. BEST has lots of experience in minimizing the voiding in QFN rework. BEST can mini
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v
The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
