New Equipment | Curing Equipment
Anda iCure series of curing ovens are compact, inline Infrared (IR) curing systems. These IR curing ovens are suitable for high volume, rapid curing of heat curable coatings, adhesives, and inks., etc. Models: iCure-2 (2 zones) iCure-3 (3 zones)
New Equipment | Curing Equipment
IR Based energy transfer curing tunnels for all curing projects including conformal coat curing.
New Equipment | Curing Equipment
For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV
New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
New Equipment | Curing Equipment
Economical On-Line Curing Oven. ICM Series is a capable, lead free CE certified reflow oven with upper & bottom individual far Infrared heater zones, pin chain & mesh belt inline conveyor. It's suitable for high-volume curing production. They are ea
New Equipment | Curing Equipment
Provide UV Curing With In Line Coating System. UV Curing machine UVC-602 adopts 2 groups of quality imported metal halide tubes with long service life , pin chain , rail conveying system and SMEMA connector makes machine easy to connect with inline
New Equipment | Rework & Repair Equipment
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a wide choice of underheater
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Solder Materials
Liquid Photoimageable Solder Application Since the introduction of Liquid Photoimageable Solder Masks (LPSIM) in the late 1980's, SolderMask, Inc. has continued to be the premier service-bureau applying it to PCB's. SolderMask, Inc. was the first
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