New SMT Equipment: j-std-002 solderability temp (Page 1 of 4)

Middle Size Lead Free SMT Reflow Oven for LED A600

Middle Size Lead Free SMT Reflow Oven for LED A600

New Equipment | Reflow

Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati

I.C.T ( Dongguan ICT Technology Co., Ltd. )

MIUST III Solderability Test (wetting balance)

MIUST III Solderability Test (wetting balance)

New Equipment | Test Equipment

MUST System III –  Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401.  Includes everything needed for all forms of solderability t

Ascentech LLC

High Temperature Type BGA Solder Ball

New Equipment |  

Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m

CCT Europe BV

Sn-9Zn

New Equipment |  

Paste, Wire Solder, Melting temp. 199C

CCT Europe BV

Sn-7Zn-Al Solder Paste

New Equipment |  

Paste, Wire Solder, Melting temp. 199C

CCT Europe BV

XY-258 Soldering Iron Variable Temp 16-30W

XY-258 Soldering Iron Variable Temp 16-30W

New Equipment | Solder Materials

Totally self contained control circuit. The lightweight, compact and portable construction will work well with all soldering applications. This unit has a temperature control on the handle as well as an LED to indicate temperature HI-Lo. UL listed. S

XYtronic-USA

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

Sn-3Ag-0.5Cu

New Equipment |  

Paste, Wire Solder, Rod, Melting temp. 220C

CCT Europe BV

Sn-0.3Ag-0.7Cu-Co

New Equipment |  

Paste, Wire Solder, Rod, Melting temp. 217 - 227C

CCT Europe BV

Sn-0.7Cu

New Equipment |  

Paste, Wire Solder, Rod Melting temp. 227C

CCT Europe BV

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