New SMT Equipment: j-std-002b (Page 1 of 1)

MIUST III Solderability Test (wetting balance)

MIUST III Solderability Test (wetting balance)

New Equipment | Test Equipment

MUST System III –  Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401.  Includes everything needed for all forms of solderability t

Ascentech LLC

Dip and Look Systems - Pulsar Solderability System

Dip and Look Systems - Pulsar Solderability System

New Equipment | Test Equipment

“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations.  After the dip process, the operator inspects the terminatio

Hentec Industries, Inc. (RPS Automation)

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Component Placement 101 Training Course
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

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