New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
New Equipment | Education/Training
The J-STD-001 Space Electronics Hardware Addendum provides additional requirements over those published in IPC J-STD-001 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic env
New Equipment | Assembly Services
Ideal for hand-held to large storage devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and opt
New Equipment | Test Equipment
Datest supplies serialized pass/fail test data, as well as detailed failure disposition reports.
These evaluation boards should be used to facilitate analysis of Z-Communications' PLLs (part numbers beginning with PCA, PSN, or PSA). The MINIEVAL/SMVEVAL/USSPEVAL boards all feature the same SMA connectorized input/output ports as shown in Figure
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
Instantly and accurately detect process changes due to variations in oven loading, convection levels, conveyor speed or zone set points errors. The SolderStar DeltaProbe is periodically passed through the reflow process to allow rapid verification of
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