Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
Description Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used industrial laminated sheet. Chact
Thickness:3-50mm,Size:1020x1220mm Description Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used
New Equipment | ESD Control Supplies
Thickness:1-30mm,Size:1020*1220mm FR4 glassfiber reinforced epoxy sheet Description This product is a kind of laminated board formed through heat pressing after the electric industry fiolax cloth dips into epoxy resin. It is suitable as the mechani
Description This product is a kind of laminated board formed through heat pressing after the electric industry fiolax cloth dips into epoxy resin. It is suitable as the mechanical, electric and electronic insulation structural components which are us
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
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