New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
New Equipment | Solder Paste Stencils
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils in the industry. We use the most advanced laser and material technologies available in the world to meet current and future industry de
New Equipment | Solder Paste Stencils
Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ
Our systems are available as stand-alone workcells for laser marking, dot peen marking, engraving to special process applications such as laser stencil cutting, welding along with turnkey operations such as automated parts loading, packaging and asse
New Equipment | Solder Paste Stencils
Fine Line introduces our Slic™ laser cut stencil. The Slic™ material has been proven to outperform the industry standard stainless steel material. Slic™ has the mechanical and thermal properties of industry standard stainless steel, yet offers superi
New Equipment | Solder Paste Stencils
BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis
VectorGuard is a patented frameless stencil tensioning system offering significant advantages over conventional stencil technologies. Taking all the benefits of frame-mounted stencil systems, VectorGuard improves upon them and delivers a solution cap
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
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