New SMT Equipment: laser align (Page 1 of 4)

Benchtop Dispense Robots

Benchtop Dispense Robots

New Equipment | Dispensing

Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard

GPD Global

Laser FPC Cutting PCB Depaneling Machine without Stress Fast and Accurate Positioning Dual Table

Laser FPC Cutting PCB Depaneling Machine without Stress Fast and Accurate Positioning Dual Table

New Equipment | Depaneling

Parameter   Parameter               Technical parameters Main body of laser 1480mm*1360mm*1412 mm Weight of machine 1500Kg Power AC220 V Laser 355 nm

ChuangWei Electronic Equipment Manufactory Ltd.

Online AC 220V 3KW Laser PCB Depaneling Machine

Online AC 220V 3KW Laser PCB Depaneling Machine

New Equipment | Depaneling

Features: 1 High Accuracy: The combination of a low-drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micrometer-level accuracy; 2 easy to learn: independent research and development of Win

ChuangWei Electronic Equipment Manufactory Ltd.

High Precise PCB Depaneling Equipment for Densely Populated PCB

High Precise PCB Depaneling Equipment for Densely Populated PCB

New Equipment | Depaneling

Specification:   Model CW-F04 Standard working area 450*350mm Power 220V, 4.2KW Manipulator Repeatability ±0.02mm Resolution ±0.01mm Board Positioning Dual workstation with nest

ChuangWei Electronic Equipment Manufactory Ltd.

JUKI JM-20 Hybrid Placement Machine

JUKI JM-20 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603~50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603~50mm, Place Speed:15,500 CPH  

Qersa Technology Co.,ltd

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

Component Printing Metal Stencil

Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

Lead Free Solder Fountain

Lead Free Solder Fountain

New Equipment |  

Standard or Lead Free models available Solder/desolder capabilities PCB Board carrier Hot AIr Blow Through Gun Laser alignment Misc nozzle sizes

Pro-Con Technologies, Inc.

SR400V-SPL Laser Vision Dispensing Robots

SR400V-SPL Laser Vision Dispensing Robots

New Equipment | Dispensing

Tip Offset Function / Dispensing Z-height Offset / Auto Vision Alignment / Tactile Tip Detect. The SR400V-SPL Laser Vision Dispensing Robot provides High Speed CCD alignment System and Laser Height Sensor, it can be correctly measured surface of wor

Plastlist Group

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