New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
The LCS 300 has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The LCS is manually loaded, and includes an automatic work piece vision alignment system. The work piece is fi
Standard or Lead Free models available Solder/desolder capabilities PCB Board carrier Hot AIr Blow Through Gun Laser alignment Misc nozzle sizes
User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Refined high-speed, high-precision technology. From the pioneer of the modular assembly line comes the latest technology in high volume production at the lowest cost of ownership. Offering an interchangeable electronic and mechanical feeder solution
VectorGuard is a patented frameless stencil tensioning system offering significant advantages over conventional stencil technologies. Taking all the benefits of frame-mounted stencil systems, VectorGuard improves upon them and delivers a solution cap
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production
