New SMT Equipment: lead bridging (Page 1 of 8)

Orange Sticks SH-83

Orange Sticks SH-83

New Equipment | Rework & Repair Equipment

Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen

Beau Tech

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

Siemens 12mm 16mm original feeder 00141092

Siemens 12mm 16mm original feeder 00141092

New Equipment | Components

http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ

Flason Electronic Co.,limited

XT-3 High-Resolution X-Ray Analyser

XT-3 High-Resolution X-Ray Analyser

New Equipment | Inspection

40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection

MatriX Technologies GmbH

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

M1m AOI - Automated Optical Inspection for Microelectronics

M1m AOI - Automated Optical Inspection for Microelectronics

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

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