New SMT Equipment: lead free bga (Page 5 of 42)

PCBA for GPS

PCBA for GPS

New Equipment |  

Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/

Shenzhen BQC Electronic CO.,Ltd.

Bob Willis On Site Theory or Hands On Workshops

Bob Willis On Site Theory or Hands On Workshops

New Equipment | Education/Training

All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s

ASKbobwillis.com

BGA rework station aft500

BGA rework station aft500

New Equipment | Rework & Repair Equipment

Specification: Rated Power: 4000W Rated voltage:AC220V /AC110V optional The first upper zone power: 800W Second temperature lower power: 800W Lower part of the preheating temperature zone Power: 2400W Dimensions: L500mm * W420mm * H550mm Weigh

HuiKe Tech

Lead Free Hot Air Reflow Oven

Lead Free Hot Air Reflow Oven

New Equipment |  

-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components

Trust Supplies

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Lead-free Solder Products

New Equipment |  

Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).

Aoki Laboratories Ltd. [Solder Products Supplier]

Printed circuit board production

Printed circuit board production

New Equipment | Assembly Services

Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard

ZOLLNER ELECTRONICS, INC.

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

Intelligent lead-free Reflow OvenT200C

Intelligent lead-free Reflow OvenT200C

New Equipment |  

A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora

Beijing Technology Company

Lead-free Reflow Oven T200A

Lead-free Reflow Oven T200A

New Equipment |  

A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor

Beijing Technology Company


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