E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
High quality with low price, Yeefung is your best choice. FEATURES: 1.Adopt English Windows 2000 operation system. The dependability is high; the speed is quick. It is easy to manage, and can connect Internet. 2.Centering support and chains convey
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
SMD Lead Free CMA Hot Air Reflow Machine Chain And Mesh Combinet Type
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
M6 and M8 lead-free reflow oven is designed for middle smt production. It goes very well with Juki, Yamaha and Samsung pick and place machine. 1. This machine is specially designed for some mid production users. 2. PC and PLC for controlling system
Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
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