Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-SL-HT is capable of lead and lead free, high temperature applications, with a programmable, digital controller for
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
Maximize Your Micro-Electronics Printing Results Transition's patented Universal Holder design gives you outstanding functionality, ergonomics and choices that enable you to achieve greater performance and profitability on your SMT line. Permalex E
Kester - With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester offers the following so
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
New Equipment | Wave Soldering
The modular system for medium production volumes, to be soldered in ambient atmosphere or with local nitrogen inertion of the solder bath. With the wave soldering system PowerWave, SEHO consequently realized a machine concept that offers a remarkab
