Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
Two models, FT01 and FT04, bench top reflow ovens working with the batch principle. Suitable for lead free soldering. FT01 has a working area of 190x290mm and the FT04 350x400mm. Reflow process works with hot air or inert gas. Unique features are: fa
New Equipment | Solder Materials
Alloy: SAC 305, Mesh: -325+500, 250 gram Jar. Buy the jar, while supplies last.
New Equipment | Solder Materials
FCT Solder manufactures a full line of leaded and lead-free solder products: Solder Wire and Bar Water Soluble Pastes Oil Water Soluble Water Washable Liquid Flux Rosin Pastes Rosin Liquid Flux Cleaners and Thinners N
Minami�s Rotary Squeegee is a high precision print head with enclosed print material (solder, adhesive, etc.) allotted from inexpensive laminated plastic bags. It applies the �paste rolling formula�. Real time paste monitoring ensures the optimum amo
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
