Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
The SF Lead-Free Reflow Oven Series provides higher throughput with a choice of eight (8), ten (10), or twelve (12) heating zones and 17.7" (450mm) adjustable wide conveyor for production runs. Utilizing our patented Horizontal Convection Heating t
This small reflow oven provides a versatile heating system for lead-free preheating, curing, reflow, rework, and thermal cycling applications in prototype or batch applications. Combination forced air convection/conduction heating system for consiste
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable,
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
The RS Ovens Efficient power design and air management system greatly improves energy savings while lowering carbon emissions. Independent Air Velocity Controlling System Independent Air Velocity Controlling System allows for flexible processing co
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
New Equipment | Solder Materials
KappFreeA the acid cored convenient one-step, Lead-free, Cadmium-free, Potable Water Solder produces strong and ductile joints on Copper and Brass without requiring additional liquid or paste flux. The internal acid flux is released on heating to rem
