New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Education/Training
Customize this course by selecting only the days/modules that meet your training requirements. Using both lead and lead-free alloys, Hand Soldering Operator Certification introduces the basics of soldering in Wires & Terminals, Through-Hole and
New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
New Equipment | Assembly Services
Multiiple assembly lines and highly trained staff support IPC level 1, 2, and 3 assembly of both surface mount and through-hole technology products. PCB assembly we offer: Surface mount, including BGAs and micro-BGAs Through-hole Mixed
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
New Equipment | Assembly Services
Wire and cable harnesses. Pick and Place services. Through hole services. Soldering services, Tin/Lead & RoHS. Box build. Testing services. KanBan services. Logistics/Drop ship services. Repair services.
Surface Mount Technology Services Siemens Siplace SMT Line Philips Topaz Line Philips Comet Line BGA Inspection and Repair Through Hole Assembly DIP Insertion Component sequencing Radial lead insertion Axial lead insertion Square Wire Insertion F
