New Equipment | Solder Materials
NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
New Equipment | Wave Soldering
Basic specification Flux capacity：6L； Flux runoff：10-100ml/min（adjustable）; Preheating zone length:1800mm(600mm×3); Quantity of preheating zone: 3 zones； Preheating temperature: room temperature～250℃; Max. preheating power：14KW; Heating comp
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Quick Overview Air Circulation Lead-Free Reflow Oven With 8/10/12 controlled upper and lower air cirulation heating zones,the E- thermal A8/A10/A12 Series SMT reflow ovens, with thermal accuracy of ±1˚C. Air Circulation Reflow Oven A Series Featur
New Equipment | Solder Materials
By combining our latest wire and alloy technologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. Product Attributes No Clean Wat
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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