We are FPC(flex printed circuit) punching tool maker in China, ISO9001:2000 certificated. We design and manufacture dies using CAD systems and high-tech computer numerical control (CNC) machine and electrical discharge machine(EDM) . By now ,we have
We are FPC(flex printed circuit) punching tool maker in China, ISO9001:2000 certificated. We design and manufacture dies using CAD systems and high-tech computer numerical control (CNC) machine and electrical discharge machine(EDM) . By now ,we have
We are FPC(flex printed circuit) punching tool maker in China, ISO9001:2000 certificated. We design and manufacture dies using CAD systems and high-tech computer numerical control (CNC) machine and electrical discharge machine(EDM) . By now ,we have
We are FPC(flex printed circuit) punching tool maker in China, ISO9001:2000 certificated. We design and manufacture dies using CAD systems and high-tech computer numerical control (CNC) machine and electrical discharge machine(EDM) . By now ,we have
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Body insulation - conformal coating Standard max. coating on leads is .125"; closer control is optional at extra cost. Marking - Trademark, Cap, Tol., T.C., and Voltage (Voltage omitted on 500V). Special disc products are also available fr
New Equipment | Test Equipment
One platform embedded instruments for validation, test and debug (ScanWorks®) ScanWorks® tools validate, characterize and test chips and circuit boards in development, manufacturing and field service. Structural integrity tests can be re-used over t
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
