New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
New Equipment | Wave Soldering
High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature, wave height, and sold
New Equipment | Solder Materials
1.120W power consumption,super thermo recovery. 2.Constant temperature heating from 1802~480 C,suited for lead free soldering. 3.LCD display,temperature locking,Stand by,auto sleeping,ESD desing. 4.Compatible with various tip shape to meet defferent
FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
Conveyor reflow oven with 50" (1270mm) long heating tunnel for low to medium volume surface mount assembly. Four (4) heating zone reflow oven with 18" (457mm) wide conveyor for production runs utilizing our patented Horizontal Convection Heating te
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
New Equipment | Assembly Services
Saline Lectronics' DFM includes a detailed PCB layout review for fabrication and a thorough inspection of the overall manufacturability of your product, including flagging any potential assembly issues. The earlier our Engineering Team can review yo
