New SMT Equipment: lead-free compatible laminates (Page 7 of 7)

Panasonic SP70 Screen Printer

Panasonic SP70 Screen Printer

New Equipment | Printing

Ultra-high accuracy screen printing Panasonic's SP70 screen printer is designed for both high- and low-volume manufacturers who require ultra-high printing accuracy. PCBs up to 580 x 508mm are processed in a smaller footprint than previous SP-serie

Panasonic Factory Solutions Company of America (PFSA)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

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