World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
New Equipment | Soldering Robots
Soldering Desktop Robot with 4 axes. X = 400mm Y = 400mm Z =100mm + Head rotation, full feeding system with engraved alloy and alloy presence sensor. Temperature control 0-480 ° C. 150W peak power. Weight: 40 kg
New Equipment | Solder Materials
The Xytronic LF-8800A 5 Tool Lead Free SMT Workstation, with an internal vacuum pump is XYtronic-USA’s best solution for all your soldering/desoldering equipment needs, especially for lead free applications! We believe you will be more than satisfied
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Synthetic Stone(the same quality of Durostone material): with black, gray, blue and red colors, etc. 2. Glass Fibre board: 3241 semiconduct
New Equipment | Rework & Repair Equipment
Designed for Standard or Lead Free Solders, Large or Small Boards, Large or Small Components. Both the RD-500III and the RD-500SIII feature 700 watt upper and lower hot air heaters. By delivering hot air simultaneously from above and below, these un
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
New Equipment | Assembly Services
- Single and double sided SMT (surface mount technology) loading. - Through-hole component loading. - Wave Soldering. - Hand Soldering. - Conformal Coating. - Prototype assembly for new designs. - Final Assembly. - Modifications to exis
