New SMT Equipment: leaded bga in lead-free paste (Page 1 of 2)

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto

New Equipment | Printing

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station

Scotle Technology Group Limited

Lead Free Technology For Electronic Assemblies Problems and Promises

New Equipment |  

Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn

Ray Prasad Consultancy Group

Lead-free Solder Products

New Equipment |  

Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).

Aoki Laboratories Ltd. [Solder Products Supplier]

Paste Flux Tacky Flux

Paste Flux Tacky Flux

New Equipment | Solder Materials

Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types

solderstoreonline.com

AMTECH Tacky Paste Fluxes

AMTECH Tacky Paste Fluxes

New Equipment | Solder Materials

AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t

AMTECH

ALPHA® Solder Paste

ALPHA® Solder Paste

New Equipment | Solder Materials

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.  Our offering includes leading lead-free, no-clean, halogen-free solder

MacDermid Alpha Electronics Solutions

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

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