New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
New Equipment | Board Handling - Conveyors
Lead Frame Loaders and Unloaders are available in a variety of configurations. We custom design your system to Auer, Perfection and other small magazines. Designed for Clean Room use, we can offer high capacity by running our magazine buffer to the r
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
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