New SMT Equipment: leadframe screen print process using flux (Page 2 of 9)

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

XH STS - Flexible Stencil and Screen Printer

XH STS - Flexible Stencil and Screen Printer

New Equipment | Printing

Automatic Offline Screen Printer The XH STS stencil and screen printing system was specially developed for printing substrates in thick film applications. The flexible system can be used in a wide number of areas within the hybrid, SMT and solar fi

ASYS Group

EKRA M2H - Entry-Level Screen Printer

EKRA M2H - Entry-Level Screen Printer

New Equipment | Printing

Semi-Automatic Screen Printer The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as prototyping purposes. But also a lar

ASYS Group

Manual Solder Paste Printer S60

Manual Solder Paste Printer S60

New Equipment | Printing

This simple printer is SMT dedicated process equipment for screen printing or leakage printing. The printing process is completed manually. It is low-cost, easy to use, easy to learn, high efficiency and suitable for small batch, research & developme

HuiKe Tech

Services

Services

New Equipment |  

Printed Circuit Board Assembly Services Through-Hole Our wave soldering and hand soldering processes are fully compliant with the highest commercial (IPC-A-610D) and military specifications. Surface Mount We use automated screen printing and pick-

Itronics

Wave Soldering Introduction & Defect Guide 2

Wave Soldering Introduction & Defect Guide 2

New Equipment | Education/Training

Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes n

ASKbobwillis.com

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

EKRA XACT 4 - Compact Screen & Stencil Printer

EKRA XACT 4 - Compact Screen & Stencil Printer

New Equipment | Printing

The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea

ASYS Group

SD 295X Series - Peelable Solder Mask

SD 295X Series - Peelable Solder Mask

New Equipment | Solder Materials

A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection

Atotech


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Thermal Interface Material Dispensing

High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications
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