New SMT Equipment: leadframe screen print process using flux (Page 7 of 9)

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

JUKI K3-II Extra Large Fully Automatic Screen Printer

JUKI K3-II Extra Large Fully Automatic Screen Printer

New Equipment | Printing

The K3-II is designed to meet the printing demands of extra large board sizes with maximum board size supported 610mm x 610mm. Vision and Optics System The simultaneous up/down Optical Structure large resolution (1.3 megapixel) digital camera enhan

Juki Automation Systems

SHS60 - 3D in-line SPI System

SHS60 - 3D in-line SPI System

New Equipment | Inspection

3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys

Hanwha Techwin CO., LTD.

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

EP-900 Two-part Silver Stencil Epoxy For Stencil Printing

EP-900 Two-part Silver Stencil Epoxy For Stencil Printing

New Equipment | Materials

4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

SPI 2500 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System

New Equipment | Inspection

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V

PARMI

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

Yamaha YSP Solder Paste Printers

Yamaha YSP Solder Paste Printers

New Equipment | Printing

High-speed High-precision Universal High-end SMT Screen Printer With the speed of the Yamaha mounters you need reliable, high speed solder paste printing. Built on the same YSP monocoque frame as Yamaha’s mounters the Yamaha YSP printer provides th

Trans-Tec

KIC Reflow Process Index (RPI) Software

KIC Reflow Process Index (RPI) Software

New Equipment | Reflow

Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T

KIC Thermal


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