New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
New Equipment | Rework & Repair Equipment
The Shuttle Star Model SV560 and SV560A are now available with a side view camera so that you can observe when the solder reflows . Rework any board and any chip with this High Definition, Split-Vision Optical System that will remove and place BGAs,
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW! All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a
세계 최고의 컨벡션 리플로우 오븐 대량의 요구에도 일관된 성능을 제공하는 동시에, 예방적 유지관리와 바닥면적은 최소화합니다 무납 인증! 유지관리 불필요! 최저의 질소 & 전기 사용! 무료로 제공되는 통합 Cpk 소프트웨어! 최근 Mark 5 리플로우 시스템 관련 혁신이 이뤄져, 보다 더 낮은 소유비용으로 제공됩니다. Heller의 새로운 가열 및 냉각 접근 방식은 최대 40%까지의 질소 및 전기 소비 절감을 제공합니다.
New Equipment | Rework & Repair Services
Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
