New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
